Abstract
The best decoupling component was the solid aluminum LILC. The prototyping result for solving the problems which was clarified at the feasibility study is presented.
Keywords: Solid Aluminum LILC, slender chip formation, chip length, aluminum film, alumina, universal test fixture, S parameter, test jig, transmission coefficient, electromagnetic coupling, roll-roll manufacturing chip length, attenuation constant, terminal impedance, FDTD simulator, transmission characteristics, poly pyrrole (Ppy), PEDOT, TCNQ, current capability.
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